公司专注于 NAND Flash 存储器的 BGA 封装技术研发与量产，面向 SSD、嵌入式存储及高可靠性应用场景，提供高密度、高一致性、可规模化交付的封装解决方案。通过系统化的封装设计与制程控制，满足高速接口与大容量存储对可靠性和稳定性的要求。 在封装结构与工艺能力方面，公司具备多 Die 堆叠 BGA 封装能力，支持高层数 NAND Die 集成与超薄化设计，可适配主流及新一代 NAND Flash 规格。封装基板与焊球设计针对高速信号传输进行优化，有效保障信号完整性与电气一致性，适用于高性能存储系统。 在可靠性与一致性控制方面，公司围绕量产应用建立了完整的工艺与质量控制体系，对关键制程参数进行精细化管理，确保封装产品在热循环、机械应力、电气稳定性等方面具备良好表现，满足长期运行与高负载应用需求。

在验证与交付层面，封装产品经过系统级测试与可靠性验证，可与主流 SSD 主控平台稳定适配，具备持续供货和批量交付能力，适用于数据中心、服务器存储及工业级应用场景。

通过持续的工艺优化与工程积累，公司 BGA 封装技术在高密度集成、可靠性控制和量产一致性方面形成了稳定优势，为客户提供具备竞争力的存储封装解决方案。

Chengbang focuses on the R&D and mass production of NAND Flash BGA packaging technologies, delivering high-density, high-consistency, and scalable packaging solutions for SSDs, embedded storage, and high-reliability applications. Through systematic package design and process control, we meet the stringent reliability and stability requirements of high-speed interfaces and large-capacity storage systems. In terms of packaging structure and process capability,  Chengbang offers multi-die stacked BGA packaging solutions, supporting high-layer NAND die integration and ultra-thin designs compatible with mainstream and next-generation NAND Flash specifications. Package substrate and solder ball designs are optimized for high-speed signal transmission, ensuring signal integrity and electrical consistency for high-performance storage systems.

For reliability and consistency control, Chengbang has established a comprehensive manufacturing and quality management system tailored for mass production. Critical process parameters are precisely managed to ensure strong performance under thermal cycling, mechanical stress, and electrical stability conditions, meeting the demands of long-term operation and high-load applications. At the validation and delivery level, packaged products undergo system-level testing and reliability verification, ensuring stable compatibility with mainstream SSD controller platforms. With robust supply continuity and high-volume delivery capabilities, our solutions are well-suited for data centers, server storage, and industrial-grade applications.

Through continuous process optimization and engineering refinement, Chengbang has developed stable advantages in high-density integration, reliability control, and mass production consistency, providing customers with competitive and dependable storage packaging solutions.